[D/F ڸ] / [D/F ] / [Ī] / [Oxide] / [Metal Stripper] / [Catalyst] / [OSP] / [PTH] / [Etc]

8. PTH

 - 𽺹̾

s

ǰ

  

Ư   

  

Swelling

Sweller

SW 300

Epoxy swelling

ȭ ° پ..

SW 300: 30~40 %V

: To balance

CCL ٸ.

 30M²B/L

Smear etching

Desmear 

PME 610

Ī

Ī ϰ

  ִ밡 ǵ ۿ

: 95 %V

 PME 610 A: 60 g/L

PME 610 B: 100 g/L

µ.: 65-80

ð: 5-10min

%ҿ뼺 30 %

ȭ

Neutralizer

NEU 1015

ҿ뼺MnO2  

ջ Ҽ ȿ

NEU 1015: 5 %V

H2SO4 : 3%V

H2O2: 1.5 %V

: To balance

µ: 25~35

ð: 4-6min

Cu: 20g/L

Area: 15 M² B/L

 

 

 

 

 

 

 

 

  

  - (, Ion Palladium Series)

ǰ

ǿ

/ M²B

׼

(per L)

м ֱ

κ

Cleaner- conditioner

PC 6000

: 93%V

PC 580C: 7%V

12 ml

Cu

5~9 %V

< 1g/L

µ.: 40-50

ð: 3-5min

10M²B/L

1 / shift

1 / day

Micro etching

SE 310

D.I water : To balance

H2SO4 : 80ml/L

SE 310 : 20ml/L

H2O2 : 30ml/L

м

Cu

<30 g/L

µ: 25-35

ð: 1-2min

6M²B/L

1 / shift

Pre-dip

PT 100

: To balance

PT 100: 1.0 %V

1.0 ml

PH

Cu

8.0-9.0

<1 g/L

µ.: 27-33

ð: 1-1.5min

10 M²B/L

1 / shift

1 / 2 days

Palladium catalyst

PCA 200

PH Corrector

: To balance

CAT 300 : 3.0 %V

Corrector: pH

3 ml

PH

Pd

Cu

9.5~10.5

80~120 ppm

 <100 ppm

µ : 40-50

ð: 3-5min

200M²B/L

1 / shift

1 / shift

1 / shift

Palladium reductant

DM 300

 :  To balance

DM 300:  0.5 %V

 H3BO3: 5 g

3 ml

PH

2~4 ml/L

8.0~9.0

µ : 20-30

ð: 3-5min

15 M²B/L

1 / shift

1 / 2days

Electroless copper

Thin copper

ITP 430M       430A

430B

D.I Water  : 76

 ITP 430 M : 12

ITP 430 A : 6

  ITP 430B : 2.2

A: 167 ml

B: 150 ml

Cu

NaOH

HCHO

1.8~2.4 g/L

8~12g/L

4-8 g/L

µ :25-30

ð: 15-20min

10 M²B/L

1 / shift

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

  - Flex, R-F Ż

ǰ

Ư

۾

׼

Alkaline cleaning

ǥ

AP 1100

1. ȭ .

2. ̵̹ ǥ

̵̹ BT ǥ ɷ

AP 1100: 250~500 ml/L

: To balance

µ.: 40~50

ð: 1-3min

1wk

Cleaning/ Conditioning

Cleaner/ Conditioner

PC 701

1. ȭ

2.ǰ Ȧ .

3.ȶ Ű

ȶ .

Ȧ ŷڼ .

PC 701A :  70ml/L

PC 701 B : 60 ml/L

: To balance

µ.: 50-60

ð: 3-7min

Cu : 1 g/l

 

 

 

 

 

 

 

 

 

  - صݰ

ǰ

 

Ư

IT 101

2 PCB

е ۾

õ

CuSO4: 75(67.5~90) g/L

H2SO4 (98%): 10(95~105) %V

Cl-: 60(50~80) ppm

IT 101 C : 10 ml/L

IT 101 A  : 3 ml/L

µ.: 24(18~30)

е: 1~4 A/d

RPP 2000

2

Reverse Pulse ÷

õ

CuSO4: 75(67.5~90) g/L

H2SO4 (98%): 10(95~105) %V

Cl-: 60(50~80) ppm

RPP 2000 C : 30 ml/L

RPP 2000 B  : 5 ml/L

е

Forward: 1~6   A/d

Reverse : 2~12 A/d

TP 400 S

ؼ ÷

(Ī Ʈ Bump ݿ )

е ۾

D/F LPR ջ

SnSO4: 40 g/L

H2SO4: 100 g/L

TP 400S: 40ml/L

µ.: 20~40

е : 0.1 ~ 5.0 A/d

MSn 4000

MSA-Tin: 70(50~90) ml/L

MSA: 160 ml/L

MSn 4000 : 40(20~60) ml/L

µ.: 20~40

е : 0.1 ~ 5.0 A/d

BT 300

ؼ ÷

(Special for soldering)

е ۾

õ

۾

MSA-Tin: 70 ml/L

MSA :  160 ml/L

BT 300C: 40(30~50) ml/L

BT 300B: 15(10~20) ml/L

µ :  20~30

е : 1 ~ 2  A/dm2

 

  - Electroless Ni/Au Plating Process

 

ǰ

Ư

۾

Ż

AC 2000

ǥ Ȱȭ Spray Dipping

AC 2000  : 10.0 %V

: To balance

µ.: 40-50

ð: 1-3 min

 

Palladium ˸

PDC 1050

ϵ ǥ鿡 Pd

  ȶ

H2SO4(98%):  4.5 %V

PDC 1050: 40 ml/L

: To balance

µ.: R.T.

ð: 1 ~ 2min

ǰ

Pd 1000±30 ppm

TCN 105

̼ȸ Ϲ PCB

ݿ

ǹݱ

•Ni-P ձ (P: 6~8%)

105 M : 150 ml/L

105 A : 45 ml/L

105D : 4 ml/L

: To balance

µ : 82

ð: 1525min

ӵ:12/hr

105 M: ǿ

105 A: ǿ

 

105 B

105 C:

105D : ǿ

 

TSX 205

Ϲ PCB

Ϲ ǰ

ǹݱ

•Ni-P ձ (P: 7~9%)

205 M : 100 ml/L

205 A : 55 ml/L

: To balance

µ : 82

ð: 1525min

ӵ:12/hr

205 M: ǿ

205 A: ǿ

 

205 B:

205 C:

ش

TCN 305

FPCB

ũǹݱ

•Ni-P ձ (P: 7~9%)

305 M : 200 ml/L

305 H : 60 ml/L

: To balance

µ : 82

ð: 1525min

ӵ:12/hr

305 M: ǿ

305 A:  

305 B

305 C:

305H : ǿ ׺

 

ħ ݵ

TMG-503

PCB SMT .

ν

ŷڼ

TMG-503:50(45~55) ml/L

Au: 1(0.8~1.2) g/L

µ : 85(80~89)

PH: 5.5  (5.0~6.0)

β.: 1~4µ

ȭд

IT 155

ABS öƽ

ȭ ݿ

Coverage

155M : 100 ml/L

155 A : 50 ml/L

155B : 50 ml/L

: To balance

µ : 32

ð: 5min

155M: ǿ

155 A: ǿ

155 B: ǿ

  - ȭ

ǰ

Ư

۾

Ż

AC 2000S

ǥ Ȱȭ

AC 2000 S : 10.0 %V

: To balance

µ: 40-50

ð: 1-3 min

Spray Cleaner

Ʈ Ī

SE 310

ǥ

ǥ

Ī ӵ

ϰ ǥ

SE 310: 5 %V

H2SO4: 4 %V

H2O2  : 4 %V

: To balance

µ.: R.T.

ð: 10-30S

Micro-etching depth: 1.0µm

Pre-dip

ݾ ϱ ħ

ݿ 굵

ݿ

ݼ

RSP 901 M : 10 V%

HNO3 : 1.0 V%

: To balance

µ : 30~50

ð: 20~60 S

60 % HNO3

Immersion Silver

RSP 901

پ .

Under cut attack .

RSP 901 M : 10 V%

HNO3 : 2.0 V%

RSP 901 A : 5 V%

: To balance

µ.: 45 ~ 55

ð: 30~60 S

β: 0.2~0.4µm

SILSTAN 25 G

پ ȿ

ȿ Ź

SILSTAN 25G: 15%V

µ: 50~55

ð: 10 ~ 60 S

 

  - ȭ ݰ

ǰ

Ư

۾

Ż

AC 2000D

ǥ

Ȱȭ

AC 2000 D : 10.0 %V

: To balance

µ: 40-50

ð: 1-3 min

                              HIPERTIN AD

ǥ Ȱ

 ϰ .

HIPERTIN AD : 25.0%V

: To balance

µ: R.T.

ð: 1-2min

HIPERTIN

980

񼮵(1st)

񵵱

(0.02-0.05um)

ݿ

HIPERTIN 980: 100 %V

µ : R.T.

ð: 1min

(2nd)

Immersion tin

(0.6-1.5um)

SM ݼ .

.

ġϰ .

HIPERTIN 980: 100 %V

µ.: 55-65

ð: 5-15min

ݼӵ: 0.1um/min

Protin 25

 

COF

Silver Matte

Protin 250M : 100%V

µ.: 64

ð: 4min

ݼӵ: 0.2um/min

 

 

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